Requisition ID: R10176360
• Category: Engineering
• Location: Linthicum, Maryland, United States of America
• Clearance Type: Secret
• Telecommute: No- Teleworking not available for this position
• Shift: 1st Shift (United States of America)
• Travel Required: Yes, 10% of the Time
• Relocation Assistance: Relocation assistance may be available
• Positions Available: 1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented and motivated Microelectronics Electroplating Process Engineer to join our Advance Material Wets Team.
Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman's ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman's ground-based radars, avionic radars, and space systems. 
Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term programs, and new programs targeting future military platforms.
Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly.
The Microelectronics Electroplating Process Engineer will work in various R&D and production process areas at ATL.  The selected candidate should be hands on and demonstrate an ability to communicate well with others.  
The Microelectronics Electroplating Process Engineer will be responsible for:
Leading and developing new wet etch processes for new materials on emerging technologies in both microelectronic and superconducting electronics Mentoring junior engineers to support their career development. Responsible for the procurement and start-up of new semiconductor equipment and processes. Develops and maintains process documentation Works with Environmental, Health, and Safety to improve safety of processes, recommend PPE, environmental monitoring, and hazardous waste handling. Training technicians and junior engineers on tool operations. Interfacing with customers, program managers, other unit process engineers, and integration engineers during the design and execution of process development and improvement projects. Performs all other related duties as assigned
#NGATL
This requisition may be filled at Principal Microelectronics Electroplating Process Engineer or Senior Principal Microelectronics Electroplating Process Engineer
Basic Qualifications for Principal Microelectronics Electroplating Process Engineer:
• Bachelors in Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 5years of relevant experience (3 years with a Masters, 0 years with a PhD).
• Must have Hands-on experience in electroplating qualification, processing and troubleshooting
• Direct experience with semiconductor fabrication, working in a R&D cleanroom environment.
• Must have experience working experience or knowledge on wet analysis and reliability tools.
• Must have experience with tool purchasing, installation, startup, and qualification.
• Experience with characterization techniques relevant to wets process engineering.      
• Must be able to work independently, providing technical solutions to a wide range of complex problems.
• Must be able to work a large percentage of time working with chemicals in a Class 100 cleanroom environment.
• Must be able to meet all physical and PPE requirements.
• Responsible for implementing, maintaining, and optimizing SPC process control.
• Experience in structured problem-solving methodology to troubleshoot tool and process issues.
• Comfortable working around and with a variety of wet chemicals.
• Must be a US Citizen
• Must be able to obtain and maintain a Secret clearance.
Basic Qualifications for Senior Principal Microelectronics Electroplating Process Engineer:
• Bachelors in Chemical Engineering, Materials Engineering, Chemistry, Physics or other related technical discipline with 8 years of relevant experience (6 years with a MS, 3 years with a PhD).
• Hands-on experience in electroplating qualification, processing and troubleshooting
• Direct experience with semiconductor fabrication, working in a R&D cleanroom environment.
• Must have experience working experience or knowledge on wet analysis and reliability tools.
• Must have experience with tool purchasing, installation, startup, and qualification.
• Experience with characterization techniques relevant to wets process engineering.      
• Must be able to work independently, providing technical solutions to a wide range of complex problems.
• Must be able to work a large percentage of time working with chemicals in a Class 100 cleanroom environment.
• Must be able to meet all physical and PPE requirements.
• Responsible for implementing, maintaining, and optimizing SPC process control.
• Experience in structured problem-solving methodology to troubleshoot tool and process issues.
• Comfortable working around and with a variety of wet chemicals.
• Must be a US Citizen
• Must be able to obtain and maintain a Secret clearance.
Preferred Qualifications:
• Ability and desire to assume a technical leadership role within the organization.
• Experience running and owning liftoff, etch and plating tools.
• Experience with pulse plating.
• Experience with technology transfers and demonstrated history of innovation.
• Excellent project management skills with demonstrated ability to identify manufacturing improvements, manage change, and implement solutions.
• Secret clearance.
#NGMCFab
Salary Range: $102,400 - $153,600
Salary Range 2: $127,000 - $190,600
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.PDN-9d71ca9e-ae26-45bc-a749-68ccb21035e0